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For Component Attachment select one of Dow Corning’s Adhesive/Sealants. Here
are some items for considerations in choosing the appropriate material for your
use:
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One or two-part heat curing adhesive/sealants offer higher throughput and
faster processing times. Heat cure times typically are shorter with increasing
temperatures. If heat cure is not practical choose a room temperature curing
product.
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One-part materials are easier to handle, two-part materials often offer
faster processing. Two-part materials are typically 1:1 mix ratio with a few at
10:1.
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For component attach, non-slump materials with little or no flow are
generally preferred.
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If your component is a power or heat-generating device, pick a higher
thermal conductivity product.
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A number of these products have UL or Mil Spec approvals.
Additional Information:
Adhesive/Sealant
Product Information
Thermally
Conductive Materials Product Information
Adhesives/Sealants
Tutorial
Thermally
Conductive Materials Tutorial
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