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Die Encapsulants
The Dow Corning group of silicon-based materials for IC packaging spans from
encapsulants and die attach adhesives to additives for epoxy molding compounds.
Dow Corning microelectronics-grade materials are currently used in the
full-scale manufacturing of chip-scale packaging throughout the world.
A chip-scale package (CSP) is about 1.2 times the dimension of the die, or
1.5 times its area.
Encapsulation is the process of encasing all of the void space beneath the
die, providing both an environmental barrier and a flexible interposer for
added reliability.
Additional Information:
Die
Encapsulant Product Information
Die
Encapsulant Tutorial
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