|
Dow Corning Compound Semiconductor Solutions is focused on supply
reliability for long-term customer success. That’s why we have invested in a
secure, world-class manufacturing facility, with the ability to produce
device-quality SiC substrates up to 100 mm in diameter. But it isn’t only our
facility that is unique. Our expertise in ultra-high purity semiconductor grade
materials, and our unique processes and strategies, will allow us to develop
crystal growth, wafering and epitaxy technologies to meet your long-term needs
and expectations.
Additional capabilities include:
-
Global infrastructure – including global manufacturing and an integrated
worldwide electronics industry supply chain
-
Dow Corning advanced packaging technology
-
Dow Corning analytical
services
For more information about our capabilities, or to discuss how we can help
with your application, contact us.
|
変更
